The aim of this paper was to analyse the compressive strength and structure of epoxy adhesive compounds containing three different fillers with good thermal conductivity, additionally prepared in variants containing different amounts of these fillers. The base of epoxy adhesive compounds was a mixture of epoxy resin and polyamide curing agent. Three fillers: aluminium, graphite and copper were used in the study. The content of each filler in the epoxy adhesive compounds was 0.5 g, 1 g and 2 g per 100 g of epoxy resin. It allowed to compare the influence of the fillers on the compressive strength between the tested epoxy adhesive compounds and on the structure of the epoxy compounds based on SEM images. To accurately show the differences between the tested samples the one-way ANOVA test and POST-HOC test were used in the study. Descriptive statistic showed that adding the fillers in the amounts used in this research, increased the compressive strength of the epoxy adhesive compounds with the same filler. The results of this analysis showed that the epoxy adhesive compounds containing the aluminium and the copper do not show statistical significance between the amounts of the used filler.